Taping and Reeling Services |
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| Aspire Electronics are pleased to bring Tape and Reeling Services to our existing and new customers. |
Tape and Reel Services include:
- All packages supported: QFP, TSOP, TSSOP, SO, SSOP, PLCC, MLF, QFN, BGA connector, odd-form etc
- High volume capacity using ‘state of the art’ automatic T and R equipment with full 3D vision capabilities
- Fast product turnaround
- Bake, Drypack, Pizza Box and Bar Code Label options
- Wafer Level package tape and reel or waffle pack with full 3D inspection
Service also include:
- SMD Tape and Reel
- Wafer Level Package T and R or Waffle Pack
- Specials / Axial and Radial
- Lead Forming and Refurbishment
- Lead Conditioning
- Component Preparation and Odd Form Devices
- Laser Marking and Bake and Dry Pack
Devices may be received in a variety of formats: wafer, strip, film frame, tray, tube or loose.
Semiconductors, electro-mechanical and mechanical devices are accommodated in technologies ranging from legacy Pin through hole (PTH) Axial and Radial technology through surface
mount device (SMD) to Wafer Level (WLP). |
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